Stock: 100
- RoHS konform: Yes
- Beschichtung: Immersion Nickel Gold
- Board Thickness: 1,5mm
- Breite/Weite: 18,4mm x 10,8mm
- Höhe inkl. Stiftleisten: 8mm
- Kupferstärke: 35µm
- Material: Epoxied FR4
- Raster: 2.54mm
- Reihenabstand: 7,62mm (.300“)
- Steckverbindertyp: DFN14 4x3mm (0.5 mm pitch)
- Typ: SMT/SMD Device Adapter
- Präzisions-Stiftleisten: zinn
- Solder Paste: Sn42Bi58 (Lead free), Schmelztemperatur ca. 139°C
this is one SMD adapter (DFN14 4x3mm to DIL14) and are compatible with the Breadboard.
The Pins are mechanically (soldering paste: Sn42Bi58) or by hand (Sn95Ag4Cu1) soldered.
Applying the solder paste with stencil:
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Available Options:
soldermask+plating:
version:
