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4,49EUR

BGA329 (1.27mm) stencil
[BGA329_1.27_stencil]

Stock: 1
  • RoHS konform: yes
  • Material: nickel silver or brass
  • Dimension: 44mm x 49mm x 100-150um
  • IC Typ: BGA329 (1.27mm pitch)
  • Typ: solder paste stencil
  • Reusability: yes
  • Cleaning: e.g. alcohol (ethanol)










Applying the solder paste with stencil: stencil TQFP 144 0.4mm pitch:
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§ pcb production:

1. date:
latest acceptance time: 19.06.2013 until 12:00 am,
production: 20.06 - 21.06.2013,
delivery: 21.06 - 24.06.2013

2. date.:
latest acceptance time: 08.07.2013 until 12:00 am,
production: 09.07 - 11.07.2013,
delivery: 11.07 - 12.07.2013

3. date.:
latest acceptance time: 22.07.2013 until 12:00 am,
production: 23.07 - 25.07.2013,
delivery: 25.07 - 26.07.2013

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